Thank you for providing me with the satisfied products and very thoughtful service! We will order again!
—— Roy Hilliard
The MoCu pads have been tested and already mounted to the components. Just wanted to let you know they are quite impressive. Completely meet our quality standards!
—— David Balazic
We have been using Jiabang's CPC1:4:1 as base flanges for about 2 years. Their products always maintain a high stability for our products. We can deliver their materials to customers with confidence. We consider zhuzhou jiabang is a trustworthy business partner.
Tungsten-Copper (W-Cu) Electronic Packing Component Heat Sink Description: Copper Tungsten is one of the most popular refractory metal based heat sink materials offered today. With the new off-the-shelf system, ... Read More
Low CTE Copper Tungsten Electronic Packaging Materials WCu Heat Sink Description: CuW, also called copper tungsten, tungsten copper and W-Cu, is a powdered metal product consisting of a mixture of copper and ... Read More
Molybdenum Copper Heat Sink For High Power RF, Microwave, Semiconductor Packaging, Optical Communication Description: Mo-Cu composite is similar with Tungsten-copper composite, its thermal expansion coefficient ... Read More
Cu-Mo-Cu (CMC) Sandwich Heat Sink of Electronic Packing Materials Description: Cu/Mo/Cu(CMC) is a sandwich composite including a molybdenum core layer and two copper clad layers. It has tailorable CTE, high ... Read More
High-tech MoCu Electronic Packaging Materials With Silver Plating Description: The MoCu composite exhibits combinational properties such as high electrical and thermal conductivities, low CTE, nonmagnetic, good ... Read More
MoCu15 Microelectronic Thermal Spreaders And Thermal Management Base Plate Description: Mo-Cu heat sink material is a composite of molybdenum and copper,the Coefficient of thermal expansion (CTE) of molybdenum ... Read More
Mo70Cu Heatspreader Materials For Automobile And Industrial Machinery Description: Mo-Cu heat sink material is a composite of molybdenum and copper, its thermal expansion coefficient and thermal conductivity ... Read More
W85Cu15 Flange For Hermetic Packages/RF Packages/Opto Packages Description: Electronic packaging material are requested certain mechanical strength, good electrical properties, thermal properties and chemical ... Read More
Copper Tungsten (WCu/CuW) / Molybdenum Copper (MoCu/CuMo) / Copper Molybdenum Electronic Packaging Materials Description: Copper Tungsten are composites of tungsten and copper. By adjusting the content of ... Read More
LDMOS RF Transistor Cu/Mo/Cu Flanges With Good Heat Dissipation Description: Cu/Mo/Cu(CMC) is a sandwich composite including a molybdenum core layer and two copper clad layers. It has tailorable CTE, high ... Read More