Product Details:
Payment & Shipping Terms:
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Material: | Copper/moly Copper/copper | Density: | 9.5 |
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CTE: | 7.3 | TC: | 170 |
Application: | RF Power Device Package | ||
High Light: | copper base plate,copper block heat sink |
No Magnetism CPC Heat Sink Flange , Copper Heat Sink For RF Power Device Package
Description:
Grade | Density g/cm3 |
Coefficient of thermal Expansion ×10-6 (20℃) |
Coefficient of thermal Expansion ×10-6 (20℃) |
CPC141 | 9.5 | 7.3 |
280(XY)/170(Z) |
CPC232 | 9.3 | 10.2 | 255(XY)/250(Z) |
Application:
Typical Applications: Microwave carriers and heat sinks, BGA Packages, LED packages, GaAs device mount.
Product picture: