Product Details:
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Material: | Copper/moly Copper/copper | Density: | 9.5 |
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CTE: | 7.3 | TC: | 170 |
Application: | RF Power Device Package | ||
High Light: | copper base plate,copper block heat sink |
CPC (Cu/Mo70Cu/Cu) Amplifier Substrate For 5G Wireless Mobile Phone Base Stations
Description:
Cu/Mo70Cu/Cu (CPC) is a sandwiched composite similar to Cu/Mo/Cu comprising a Mo70-Cu alloy core layer and two copper clad layers. The ratio of the thickness in Cu Mo70Cu and Cu layers is 1:4:1. It has different CTEs in the X and the Y direction. Its thermal conductivity is higher than those of W/Cu, Mo/Cu, Cu/Mo/Cu and it is much cheaper.
Grade | Density g/cm3 |
Coefficient of thermal Expansion ×10-6 (20℃) |
Coefficient of thermal Expansion ×10-6 (20℃) |
CPC141 | 9.5 | 7.3 |
280(XY)/170(Z) |
CPC232 | 9.3 | 10.2 | 255(XY)/250(Z) |
Application:
Typical Applications: Microwave carriers and heat sinks, BGA Packages, LED packages, GaAs device mount,mobile phone base stations.
Product picture: